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廣瀬 明夫

略歴

1979.3

大阪大学 工学部 溶接工学科 大学 卒業

1981.3

大阪大学 工学研究科 溶接工学専攻 修士 修了

1981.4

大阪大学・助手

1990.6-1991.3

マサチューセッツ工科大学客員研究員

1994.4-2006.3

大阪大学・助教授

2006.4

教授

研究キーワード

機能化プロセス工学

研究内容

界面組織制御による異種材料接合プロセス、ナノ粒子・ナノ構造を利用した材料プロセシング、エレクトロニクスにおけるマイクロ接合、材料のレーザ加工

所属学会

ASM International、エレクトロニクス実装学会、レーザ加工学会、軽金属溶接構造協会、日本金属学会、日本材料学会、日本鉄鋼協会、日本溶接協会、溶接学会、軽金属学会

受賞

2011.7

大阪大学功績賞

2010.9

日本金属学会技術開発賞

2010.4

International Conference on Electronics Packaging 2009 Outstanding Technical Paper Award

2007.4

International Conference on Electronics Packaging Outstanding Technical Paper Award (Japan Institute of Electronics Packaging)

2006.10

大阪大学論文100選

2005.9

Outstanding Paper of the 37th International Symposium on Microelectronics (International Microelectronics and Packaging Society)

2004.11

IMS成果賞2004 （（財）製造科学技術センター）

2004.11

PSEA (International Conference on New Frontiers of Process Sciences and Engineering in Advanced Materials) Excellent Poster Award (High Temperature Society)

2003.10

MES2002ベストペーパー賞 （エレクトロニクス実装学会）

2002.4

溶接学会国際協力賞

2000.5

軽金属構造溶接協会論文賞

1995.4

溶接学会論文奨励賞

最近の発表論文

Synthesis of submicron metastable phase of silicon using femtosecond laser-driven shock wave, M. Tsujino, T. Sano, O. Sakata, N. Ozaki, S. Kimura, S. Takeda, M. Okoshi, N. Inoue, R. Kodama, K. F. Kobayashi, and A. Hirose, Journal of Applied Physics, Vol.110(2011), 120163

Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag₂O for Packaging of High-temperature Electronics, A. Hirose, N. Takeda, H. Tatsumi, Y. Akada, T. Ogura, E. Ide and T. Morida, Materials Science Forum, Vol.706-709(2012), pp.2962-2967

Partitioning evaluation of mechanical properties and the interfacial microstructure in a friction stir welded aluminum alloy/stainless steel lap joint, Tomo Ogura, Yuichi Saito, Taichi Nishida, Hidehito Nishida, Takumi Yoshida, Noriko Ohmichi, Mitsuo Fujimoto and Akio Hirose, Scripta Materialia, Vol.66(2012), pp.531-534

Evaluation of interfacial bonding utilizing Ag₂O-derived silver nanoparticles using TEM observation and molecular dynamics simulation, Tomo Ogura, Masumi Nishimura, Hiroaki Tatsumi, Naoya Takeda, Wataru Takahara and Akio Hirose, The Open Surface Science Journal, Vol.3(2011), pp.55-59

Nanoindentation Measurement of Interfacial Reaction Layers in 6000 Series Aluminum Alloys and Steel Dissimilar Metal Joints with Alloying Elements, Tomo Ogura, Keisuke Ueda, Yuichi Saito and Akio Hirose, Materials Transactions, Vol.52(2011), pp.979-984

Effects of Zn-based Alloys Coating on Mechanical Properties and Interfacial Microstructures of Steel /Aluminum Alloy Dissimilar Metals Joints Using Resistance Spot Welding Keisuke Ueda, Tomo Ogura, Shumpei Nishiuchi, Kenji Miyamoto, Toshikazu Nanbu and Akio Hirose, Materials Transactions Vol.52(2011), pp.967-973

Microstructure and Mechanical Properties of 5000 Series Aluminum Stud Joints with Zn Insert Using Friction Welding, Taichi Nishida, Tomo Ogura, Mitsuo Fujimoto and Akio Hirose, Materials Transactions Vol.52(2011), pp.960-966

Dissimilar Joining of Aluminum Alloy and Steel by Resistance Spot Welding, Kenji Miyamoto, Shigeyuki Nakagawa, Chika Sugi and Hiroshi Sakurai and Akio Hirose, SAE International Journal of Materials and Manufacturing, Vol. 2(2009), pp.58-67

Effects of Copper Alloying on the Bondability of Dissimilar Joints of Aluminum Alloys to Steel, Yuichi Saito, Hidetaka Umeshita, Tomo Ogura and Akio Hirose, Quarterly Journal of JWS, Vol. 27(2009), pp.187s-191s

A novel metal-to-metal bonding process through in-situ formation of Ag nanoparticles using Ag₂O microparticles, Akio Hirose, Hiroaki Tatsumi, Naoya Takeda, Yusuke Akada, Tomo Ogura, Eiichi Ide and Toshiaki Morita, Journal of Physics: Conference Series, Vol.165 (2009), 012074