2024年7月21-26日にカナダバンクーバーで開催されます第16回世界計算力学会議（the 16th World Congress on Computational Mechanics (WCCM 2024)）にて、 小泉雄一郎教授がピッツバーグ大学のAlbert To 教授らとともに、シンポジウム Modeling and Simulation for Additive Manufacturing をオーガナイズいたします。 そのAbstract提出締め切りは、2024年1月15日と迫っております。多数の方の奮っての申し込みならびに関係の方へのご連絡をいただけますと幸いです。 The 16th World Congress on Computational Mechanics (WCCM 2024) is set to be held in Vancouver, Canada, from July 21-26, 2024. Professor Yuichiro Koizumi will be organizing a symposium titled “Modeling and Simulation for Additive Manufacturing” alongside Professor Albert To from the University of Pittsburgh. The deadline for submitting abstracts for this symposium is fast approaching on January 15, 2024. Your enthusiastic participation and invitation to others interested are greatly appreciated.
Dear all
It is with great pleasure to invite you to submit an abstract of your presentation to the 16th World Congress on Computational Mechanics (WCCM 2024) and 4th Pan American Congress on Computational Mechanics (PANACM 2024) to be held in Vancouver, Canada on July 21-26, 2024.
Our Minisymposium “Modeling and Simulation for Additive Manufacturing” has been a part of USNCCM/WCCM since 2017, and it has been well received and attended. It will be exciting to learn about the latest progress and advancement from your research activities in additive manufacturing.
If it fits your schedule, we hope that you can submit an abstract of your presentation to Minisymposium 1101 Modeling and Simulation for Additive Manufacturing: https://www.wccm2024.org/abstract-submission. A detailed description of the minisymposium is attached below. Abstract deadline is January 15, 2024.
More information on the Congress can be found at the Congress website: https://www.wccm2024.org/
Sincerely yours,
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Modeling and Simulation for Additive Manufacturing
Various additive manufacturing (AM) techniques including 4D printing have been developed to manufacture complex-shaped components with well-controlled precision. Sophisticated AM techniques often require systematic modeling and simulation efforts during the design stage and for the purpose of part qualification/certification. The objective of this minisymposium is to provide a platform to discuss recently developed modeling and simulation techniques for AM, including experimental calibration and validation efforts for the process. The topics include (but are not limited to):
Simulation of the manufacturing process to predict heat transfer, residual stress/distortion, melt pool dynamics, surface topology, composition, and microstructure including defects at multiscale length and time scales
Adaptive discretization strategies, efficient numerical solution schemes, and model order reduction approaches allowing for highly efficient simulations at the part-scale
Thermo-mechanical material modeling
Data-driven approaches for simulation acceleration
Combined simulation and in-situ monitoring for rapid build qualification
Effects of microstructure and defects on mechanical properties
Feedback control for minimizing defects and residual stress in as-built structures
AM-oriented topology optimization
Analysis of lattice and cellular structures
Modeling and simulation of functionally graded materials, tissue engineering scaffolds, bioinspired composites, bi-material joints, etc.
Computational modeling and simulation for any AM processes (e.g. laser power bed fusion, electron beam melting, form deposition modeling, stereolithography, binder jetting) and materials (e.g. metals, plastics, ceramics and their composites as well as biological materials) are welcome.
Organizers:
Thorsten Bartel, Technical University of Dortmund, Germany
Michele Chiumenti, UPC Barcelona, Spain
Yuichiro Koizumi, Osaka University, Japan
Stefan Kollmannsberger, Technical University of Munich, Germany
Andreas Lundback, Lulea University of Technology, Sweden
Dan Moser, Sandia National Laboratories
Theron Rodgers, Sandia National Laboratories
Christoph Meier, Technical University of Munich, Germany
Mike Stender, Sandia National Laboratories
Ashley Spear, University of Utah, USA
Albert To, University of Pittsburgh, USA
Gregory Wagner, Northwestern University, USA
Yaoyao Fiona Zhao, McGill University, Canada
